Soldering Technology Laboratory

As part of the Electronics Prototyping and Manufacturing Mission, of the Electronics and Prototyping Branch, the Semi-Automated, Surface Mount Technology (SMT) Soldering System greatly enhances the reliability and repeatability of the SMT soldering process. The design and function of the system is ideal for small-batch and test-run manufacturing, rework, and component replacement. Being operator-controlled, the system allows for rapid set-up, adjustment, and modification, in addition to being easily maintained. The system is fully capable of utilizing either solder paste "tack" or adhesive methods of component-to-board retention prior to soldering. Dedicated, recirculating air filtration is utilized to negate the need for outside venting of the soldering process.